Special Topic ST:PHY5937 Device Prototyping
HPA1 0363, Credits: 3 (0,3) TuTh 9-11 a.m. PSB 440
Prof: Robert E. Peale, PSB 423, Robert.Peale@ucf.edu
Office hours: MW 3:30-4:30
Graduate standing or consent of instructor.
Fabrication and characterization of
micro-scale devices, including micro-electrical-mechanical
systems, sensors, optical devices, and micro-fluidic devices.
Goals and objectives:
Learn the techniques of fabricating
and characterization micro-scale devices in a hands-on clean-room
environment. Topics include photo- and electron-beam lithography,
electron-beam evaporation, sputtering, metal lift-off, reactive
ion etching, inductively coupled plasma etching, barrel ashing,
wet etching, plasma-enhanced chemical vapor deposition, sacrificial
layers, optical microscopy, profilometry, microprobe-station,
4-point probe resistivity measurement, scanning electron microscopy,
UV-visible spectroscopy, atomic force microscopy. A goal is that
students who pass this course can be given key-card access to the
facilities to begin their dissertation research.
S. Wolf and R. N. Tauber, Silicon Processing
for the VLSI Era, Volume 1-Process Technology, (Lattice Press, Sunset Beach, CA 1986).
Environmental Health and Safety training,
Photolithograpy, descum, metal deposition, and lift-off. Optical microscopy.
PECVD oxide growth, wet etching. Profilometry. 4 point resisitivity measurement.
RIE-ICP etching, barrel-ashing, scanning electron
microscosopy, Electron-beam lithography, UV-vis spectroscopy, atomic force microscopy.
Make and characterize final project device:
Deep fluid channels, optical planer waveguides, air-bridges, cantilevers,
Course assignments (assignments and exams):
This is a hands on laboratory
with all class time spent in the physics Microdevice Prototyping Facility (MPF).
There will be assigned reading, one midterm and a final based on the assigned
reading and standard operation procedures for the instruments in MPF, and a
final fabrication project.
Methods of evaluation:
Participation will count for 25%, midterm 25%,
final project 25%, final exam 25%. The final course grade will be available on myucf.
PHYSICS DEPT MISSED WORK POLICY: Making up missed work is permitted only
for UCF-sanctioned activities and bona fide medical or family reasons.
Authentic justifying documentation must be provided in every case (in advance
for UCF-sanctioned activities). The form of the make-up will be determined by the instructor.
- Environmental Health and Safety training (Basic. Online and in-lab practical).
- Cleanroom etiquette.
- Traveler sheets.
- Photolithograpy (Spinner, hot plate, mask aligner, grating masks, squares).
- Descum (Samco and Barrel Asher)
- Metal deposition (Electron-beam evaporators, Cressington, MRC, thermal evaporation)
- Lift-off. (Chemical hood)
- Optical microscopy (Record images, Lateral dimensions).
- Profilometry (Measure metal thicknesses).
- Deliverable: Report results.
- PECVD oxide growth on metal squares.
- Resist mask on squares.
- Wet etch oxide in BOE to Si substrate.
- Dry etch oxide (Barrel asher, trion) to substrate).
- Strip resist
- Undercut etch into Si on Barrel asher.
- Dry etch to remove oxide mask.
- Deliverable: Report results.
- Mid term
- scanning electron microscosopy,
- Electron-beam lithography,
- 4 point probe.
- UV-vis spectroscopy,
- Atomic force microscopy.
- Deep fluid channels,
- optical planer waveguides
- Final Project
- Final Exam